发明名称 Printed wiring board and method of producing the same
摘要 A printed wiring board comprises an insulating layer having a plurality of recesses formed along a predetermined edge portion of the insulating layer to extend through a side surface of the insulating layer, tabs for establishing electrical connection with an external electronic apparatus and which are formed on a surface of the insulating layer along the predetermined edge portion in correspondence with the plurality of recesses, and extensions connected electrically to the respective tabs and extending into the respective recesses. The printed wiring board may further comprise a plurality of dummy pads which are buried under the insulating layer in correspondence with the tabs and the extensions and which are electrically insulated from each other. The extensions are joined to the dummy pads through the recesses. The resulting board comprises a structure in which tabs are not easily peeled from an insulating layer.
申请公布号 US2002020555(A1) 申请公布日期 2002.02.21
申请号 US20010921202 申请日期 2001.08.01
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 DAIDO YUKIKO
分类号 H05K1/11;H05K3/00;H05K3/24;H05K3/40;H05K3/46;(IPC1-7):H05K1/11 主分类号 H05K1/11
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