Substrate interconnect for power distribution on integrated circuits

摘要

A backside interconnect structure is used to deliver power through the substrate to the front side of an integrated circuit. One or more power planes are formed on the backside of the substrate and coupled to power nodes on the front side by deep vias in the substrate. In a specific embodiment of the invention, power planes are coupled through the substrate to front side metal lines, well taps and external connection points. Placing power planes on the opposite side of the substrate from the signal interconnects allows the use of low dielectric constant materials between signal lines, while using high dielectric constant materials between power planes thus increasing decoupling capacitance without increasing parasitic capacitance between signal lines.