发明名称 PROTECTIVE COVER FOR TITANIUM CASE FOR COPPER ELECTROPLATING, AND COPPER ELECTROPLATING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a protective cover for a titanium case for copper electro plating which is capable of minimizing the deformation of the titanium case, lessens a stray current and can apply uniform plating to an object to be plated and copper electroplating method. SOLUTION: In this protective cover, the titanium case 10 is insertable and is formed into a cylindrical shape made of a resin in order to cover the outer wall surface of the titanium case 10 inserted therein. In the side wall part 20 on the front side which is the side wall part on the side facing an object to be plated, plural through-holes 22 are formed. The through-holes 22 are so arranged that the sum of the opening areas in an upper region A of the side wall part 20 by the through-holes 22 is smaller than the sum of the opening areas of a lower region C and that the sum of the opening areas of an intermediate region B is the intermediate size of the sum of the opening areas of the upper region A and the sum of the opening area of the lower region C. The side wall part 24 on the rear side which is the side wall part on the side opposite to the side wall part 20 on the side facing the object to be plated are substantially not provided with the through-holes.
申请公布号 JP2002053998(A) 申请公布日期 2002.02.19
申请号 JP20000238095 申请日期 2000.08.07
申请人 KYODEN:KK 发明人 KARAKI ISAO
分类号 C25D17/12;(IPC1-7):C25D17/12 主分类号 C25D17/12
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