| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a pick-up device and method, which when picking up a thinned chip, can suppress crackings and improve the quality of the chip. SOLUTION: When a chip is released from an adhesive tape 28 by a pin of an ejecting mechanism 22; a collect 28 holdingly sucks a back side of the adhesive tape opposed to the adhesive surface; is moved closer to the upper side of a chip from the adhesive side of the adhesive tape, moved gradually downward until the collet comes into contact with the chip and sucks it; waits until the chip is released from the adhesive tape; and then the collect is moved upward to pickup the chip. The peeling off of the chip can be promoted by making the pin remain there. Furthermore, when dicing is completed and a chip attached onto the adhesive tape is picked up, the chip can be released from the tape without damage, by blowing a high-temperature inactive gas on the tape and instantaneously heating it.</p> |
