发明名称 TOOL FOR PLATING PRINTED CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To provide a tool for plating a printed circuit board which prevents the printed circuit board from being cur warped by the flow of the liquid in a plating tank during the plating operation, increases the strength of a holding member, and prevents a locking part from being locked to a longitudinal wall part so that a clip is prevented from being scattered by the reaction when the clip is detached from the holding member. SOLUTION: In this tool for plating the printed circuit board, one supporting part 16 of a pair of fork-like supporting parts of the holding member 12 for holding the printed circuit board is disposed at a right angle with reference to the longitudinal wall part 17 of the holding member, the other supporting part 16' is disposed so as to have an opening with reference to the one supporting part, and the clip 31 comprises a tip insertion part 311 for locking the printed circuit board to a guide groove 15 of the holding member 12, an inwardly curved elastic bent part 312, an inwardly curved elastic part 313 for elastically supporting the longitudinal wall part 17 which is curved outwardly of the holding member, the locking part 314 to be locked to the longitudinal wall part of the holding member, and a holding part 315.
申请公布号 JP2002047599(A) 申请公布日期 2002.02.15
申请号 JP20000227985 申请日期 2000.07.27
申请人 ONO SEISAKUSHO:KK 发明人 ONO MITSUO
分类号 C25D7/00;C25D17/08;H05K3/18;(IPC1-7):C25D17/08 主分类号 C25D7/00
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