| 摘要 |
<p>A solder plating system comprises a fabrication cell wherein a solder plating is applied to a device being processed. A carrier belt supports the device being processed and includes a plurality of alignment holes for being supported on a plurality of sprocketed carrier wheels. Each sprocketed carrier wheel includes a plurality of sprocket pins positioned in radials holes about the periphery of the carrier wheel for engaging the plurality of alignment holes in the carrier belt. Each sprocket pin includes a locking extension which secures the sprocket pin into the carrier wheel and prevents the sprocket pin from being dislodged from the radial hole.</p> |
