发明名称 Method for making a multilayer board having a cavity
摘要 A method for making a multilayer board with a cavity comprises forming a composite comprising a plurality of dielectric layers (2) and at least one release layer (3) provided between at least one adjacent pair of dielectric layers, and forming a cavity having a bottom face defined by the release layer (3) by removing a portion (2b) of the composite located above the release layer. The portion to be removed may be formed by cutting (4) with blades (5) through the composite or by other means such as laser cutting. The method facilitates production of multilayer ceramic boards with cavities having high planarity.
申请公布号 GB2364828(A) 申请公布日期 2002.02.06
申请号 GB20010013101 申请日期 2001.05.30
申请人 * MURATA MANUFACTURING CO LTD 发明人 HIDEYUKI * HARADA;HIROSHI * TAKAGI
分类号 B32B38/10;H01L21/48;H01L23/12;H01L23/13;H05K1/03;H05K1/18;H05K3/46 主分类号 B32B38/10
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