| 摘要 |
PROBLEM TO BE SOLVED: To provide a structure capable of maintaining the airtightness of a feedthrough capacitor provided in a pressure sensor. SOLUTION: The pressure sensor includes a housing with a pressure introduction hole therein, and a pressure sensor body having therein a reference pressure space formed by hermetically welding together a sensor element consisting of a semiconductor element having a piezoresistance effect, a holder with the sensor element secured thereto, and a pressure case having electromagnetic shielding action. A tubular dielectric 43 provided with an outer electrode 439 and an inner electrode 431 is hermetically fixed to the pressure case 60 and a lead 42 for guiding an output from the sensor element to a predetermined external terminal is passed through an inner through hole in the dielectric 43 and is soldered to the inner electrode 431 by use of solder 91. The inner electrode 431 of the dielectric 43 is formed as a laminate of films consisting of a nickel plating film 432, an intermediate film 433, another nickel plating film 434 and a solder plating film 435, and the solder 91 has a small coefficient of thermal shrinkage. Soldering is carried out in such a way that the solder 91 exists in part of the through hole in the dielectric 43.
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