| 摘要 |
An electronic unit is provided that effectively utilizes the upper surface of a circuit board as a wiring pattern and reduces the size of the electronic unit. Wiring patterns and grounding patterns are provided on the upper surface of a circuit board. The wiring patterns and grounding patterns are connected to wiring terminal electrode portions and grounding terminal electrode portions by connection conductors, respectively, provided in through-holes. This allows a cover, covering electronic parts on the circuit board, to be effectively mounted as the entire outer periphery of the first surface of the circuit board is covered.
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