发明名称 METHOD OF PLACING CONDUCTOR LAYERS ON DIELECTRIC SURFACES
摘要 <p>PURPOSE: A method for producing conductor coating on dielectric surface is provided to enhance qualities of a dielectric surface by manufacturing press-forms using the galvanoplastic method, or for assemblies for shielding electromagnetic emission in order to use in various areas of industry for the preparation of dielectric surfaces of electroplating. CONSTITUTION: Profiled articles from shock-resistant polystyrene, with surface area of 70 cm, etching 5 minutes at room temperature with 17M H2SO4 and 0.5M KJO4. Items are rinsed with water after etching and treated for 10 minutes in solution which contains 0.01M CoF3 and 0.35M NH4OH, under room temperature. After this, the items are rinsed in acetic acid up to pH 5 in acid water and treated for 30 seconds in sulphide solution which contains 0.1 M Na2S. After treatment, the items are rinsed with distilled water, dried and nickel-plated for 15 minutes in Watts electrolyte, containing(M): NiSO4 - 1.2; NiCl2 - 0.2 and H3BO3 - 0.5; initial flow density 0.3 A/dm, temperature 40 DEG C.</p>
申请公布号 KR20020009439(A) 申请公布日期 2002.02.01
申请号 KR20010043731 申请日期 2001.07.20
申请人 SHIPLEY COMPANY, L.L.C. 发明人 BARANAUSKAS MYOKOLAS
分类号 H05K3/18;C25D5/54;(IPC1-7):H05K3/18 主分类号 H05K3/18
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