发明名称 MULTILAYER BOARD AND MANUFACTURING METHOD
摘要 PURPOSE: To provide a multilayer board on which the electrodes has strong adhesion strength to glass-containing insulation layers and excellent solderability, and manufacturing method of the board. CONSTITUTION: Manufacturing processes of the multilayer board comprises a process for applying an electrode paste on the surface of a green sheet containing a crystallized glass with the viscosity before crystallization of <= 10 6.0 Pa.s in order to form electrodes, a process for forming a laminated compression body by laminating and compressing the green sheet on which the electrode paste is applied, and a process for sintering the laminated compression body. The green sheet includes the crystallized glass with the viscosity before crystallization of <= 10 6.0 Pa.s and a ceramics, and the volume ratio of the crystallized glass is in the range of 45 to 80%.
申请公布号 KR20020009441(A) 申请公布日期 2002.02.01
申请号 KR20010043769 申请日期 2001.07.20
申请人 MURATA MANUFACTURING CO., LTD. 发明人 KAWAKAMI HIROMICHI;NIWA YOSHIHITO
分类号 H05K1/09;H01L23/15;H01L23/498;H05K1/03;H05K3/46 主分类号 H05K1/09
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