发明名称 |
MULTILAYER BOARD AND MANUFACTURING METHOD |
摘要 |
PURPOSE: To provide a multilayer board on which the electrodes has strong adhesion strength to glass-containing insulation layers and excellent solderability, and manufacturing method of the board. CONSTITUTION: Manufacturing processes of the multilayer board comprises a process for applying an electrode paste on the surface of a green sheet containing a crystallized glass with the viscosity before crystallization of <= 10 6.0 Pa.s in order to form electrodes, a process for forming a laminated compression body by laminating and compressing the green sheet on which the electrode paste is applied, and a process for sintering the laminated compression body. The green sheet includes the crystallized glass with the viscosity before crystallization of <= 10 6.0 Pa.s and a ceramics, and the volume ratio of the crystallized glass is in the range of 45 to 80%. |
申请公布号 |
KR20020009441(A) |
申请公布日期 |
2002.02.01 |
申请号 |
KR20010043769 |
申请日期 |
2001.07.20 |
申请人 |
MURATA MANUFACTURING CO., LTD. |
发明人 |
KAWAKAMI HIROMICHI;NIWA YOSHIHITO |
分类号 |
H05K1/09;H01L23/15;H01L23/498;H05K1/03;H05K3/46 |
主分类号 |
H05K1/09 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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