| 摘要 |
This invention is directed to a spring probe assembly (10) which contains spring probes (50, 60) used for mating to various planar devices, such as a printed circuit board, via spring contact with interface areas on their surfaces. The assembly (10) is comprised of a non-metallic, insulating material block (20) which has been crafted to secure multiple, impedance matched, coaxial spring probe assemblies (50) and ground spring pins (60). A metallic clip (70) is used to join signal probe shield 54 with the ground spring pin (62) in the appropriate geometry, while isolating that signal probe shield (54) and ground spring pin (62) from all other signal probe shields (54) and ground pins (62). The pins (52) of the signal probes (50) make contact with the surfaces of various planar devices via back pressure applied to the pins (52). |
