发明名称 RESIN MOLDING WITH PRESSURE-SENSITIVE ADHESIVE SHEET STUCK THERETO
摘要 PROBLEM TO BE SOLVED: To provide a resin molding which, when a pressure-sensitive adhesive tape is stuck thereto, does not decrease the holding power of the adhesive sheet with time even when the molding contains a plasticizer. SOLUTION: The same plasticizer as that contained in the resin molding is incorporated in advance into the pressure-sensitive adhesive layer of the adhesive sheet to eliminate the concentration gradient of the plasticizer between the resin molding and the pressure-sensitive adhesive layer; thus, the migration of the plasticizer from the molding to the adhesive layer is prevented.
申请公布号 JP2002030156(A) 申请公布日期 2002.01.31
申请号 JP20000216774 申请日期 2000.07.18
申请人 DAINIPPON INK & CHEM INC 发明人 YAMAGAMI AKIRA;ICHIHARA SHINICHI;TANABE HIROSUKE;YAMADA AKIHIRO
分类号 C08J5/12;C08L101/00;C09J7/02;C09J153/02;(IPC1-7):C08J5/12 主分类号 C08J5/12
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