| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit board with a thin film capacitor built-in with high manufacturing yield capable of preventing the increase of leakage currents or the deterioration of breakdown voltage even when reducing the film thickness of a dielectric layer, and to provide a method for manufacturing the circuit board. SOLUTION: A circuit board is equipped with a capacitor formed by sequentially laminating a first electrode layer, a dielectric layer constituted of at least one layer, and a second electrode layer on a base board. An insulating layer including at least one element constituting the first electrode layer is arranged between the pin hall part of the dielectric layer or/and the crystal grain boundary part of the dielectric layer and the first electrode. In this case, the first electrode layer is constituted of materials whose oxide indicates conductive characteristics in a state such that oxygen is insufficient, and turns to be an insulator according as it becomes close to stoichiometric composition.
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