SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device where the number of processes is reduced and the degree of freedom on the process can be improved. SOLUTION: Various wirings are divided into a long distance wiring and a short distance wiring and a long distance wiring module 11 and a short distance wiring module 12 are separately formed. A signal line 13 and a ground layer 14 are disposed in the long distance wiring module 11 and elements are formed in the short distance wiring module 12. The pads 11a of the long distance wiring module 11 and the pads 12a of the short distance wiring module 12 are bonded. Electrodes in the respective modules 11 and 12 are connected and are integrated.