发明名称 |
Gate structure and method for manufacture thereof |
摘要 |
A method for forming a gate structure beginning with a semiconductor substrate provided with an isolation region formed therein. An HfO2 layer and a conductive layer are formed on the semiconductor substrate, subsequently. The conductive layer and the HfO2 layer are patterned into the gate structure. By utilizing an HfO2 layer as a gate dielectric, an effective K of the gate dielectric can be controlled to within 18 to 25. In addition, by employing a CVD method for forming the HfO2 layer, it is possible to obtain a high K gate dielectric with excellent leakage current characteristic as well as a low interface state with both a gate electrode and a semiconductor substrate.
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申请公布号 |
US2002008297(A1) |
申请公布日期 |
2002.01.24 |
申请号 |
US20010883188 |
申请日期 |
2001.06.19 |
申请人 |
PARK DAE-GYU;CHO HEUNG-JAE |
发明人 |
PARK DAE-GYU;CHO HEUNG-JAE |
分类号 |
C23C16/40;H01L21/28;H01L21/314;H01L21/316;H01L21/336;H01L29/51;(IPC1-7):H01L29/00 |
主分类号 |
C23C16/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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