Semiconductor package

摘要

A thermal conductive sheet 11 including at least 70-95 weight parts of inorganic filler and 5-30 weight parts of thermosetting resin composition and having flexibility in an uncured state is prepared. Through-holes 33 are formed in the thermal conductive sheet 11, a conductive resin composition 13 is filled in the through-holes 33, and the external electrode 15 is connected electrically with the semiconductor chip 12 via the conductive material.