发明名称 HEAT SINK AND ELECTRONIC APPARATUS
摘要 PROBLEM TO BE SOLVED: To improve cooling effect and noise reducing effect of heat generating components used in information processors. SOLUTION: The underside of the heat sink 13 contacts a heating member 15, a cooling fan 11 composed of at least a blade 11(a) and a motor 11(b) is disposed on top of the heat sink 13, and a sound absorbing material 16 is pasted to a part or all of the side faces of fins and it is enclosed with a heat sink cover 12. Heat conductive sheets 14 are sandwiched and thermally compression- bonded between the fin tops of the heat sink 13 and the heat sink cover 12 and between the side faces of the heat sink 13 and the cover 12.
申请公布号 JP2002009475(A) 申请公布日期 2002.01.11
申请号 JP20000185914 申请日期 2000.06.16
申请人 HITACHI LTD 发明人 SAEKI SUKEYUKI;MATSUSHITA SHINJI
分类号 H05K7/20;H01L23/36;H01L23/467;(IPC1-7):H05K7/20 主分类号 H05K7/20
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