发明名称 |
HEAT SINK AND ELECTRONIC APPARATUS |
摘要 |
PROBLEM TO BE SOLVED: To improve cooling effect and noise reducing effect of heat generating components used in information processors. SOLUTION: The underside of the heat sink 13 contacts a heating member 15, a cooling fan 11 composed of at least a blade 11(a) and a motor 11(b) is disposed on top of the heat sink 13, and a sound absorbing material 16 is pasted to a part or all of the side faces of fins and it is enclosed with a heat sink cover 12. Heat conductive sheets 14 are sandwiched and thermally compression- bonded between the fin tops of the heat sink 13 and the heat sink cover 12 and between the side faces of the heat sink 13 and the cover 12.
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申请公布号 |
JP2002009475(A) |
申请公布日期 |
2002.01.11 |
申请号 |
JP20000185914 |
申请日期 |
2000.06.16 |
申请人 |
HITACHI LTD |
发明人 |
SAEKI SUKEYUKI;MATSUSHITA SHINJI |
分类号 |
H05K7/20;H01L23/36;H01L23/467;(IPC1-7):H05K7/20 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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