发明名称 METHOD OF PRODUCING METALLIC COMPACT BY ELECTROLESS PLATING, AND THE METALLIC COMPACT
摘要 PROBLEM TO BE SOLVED: To provide a method of producing a metallic compact, in which the thin film-shaped, precise and lightweight compact can be obtained by making use of the film formability of electroless plating. SOLUTION: The method of producing the metallic compact comprises (1) a process for providing a metallic base material by processing a metal stock into the form of the objective compact, (2) a process for heating a plating liquid an a bath to 45 to 100 deg.C and forming a metallic film having a prescribed thickness on the surface of the metallic base material by subjecting the metallic base material to electroless plating while adding a surfactant in an amount of 0.5 to 1,000 ppm and (3) a process for removing the mold by melting the metallic base material by alternately dipping the coated metallic base material into an acid solution and an alkaline solution while allowing the coated metallic film to remain.
申请公布号 JP2002004058(A) 申请公布日期 2002.01.09
申请号 JP20000181039 申请日期 2000.06.16
申请人 KUWANA SHOJI KK 发明人 KUWANA AKIRA;MITSUSHIBA YOSHIE
分类号 C23C18/31;(IPC1-7):C23C18/31 主分类号 C23C18/31
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