METHOD FABRICATING CHIP SCALE PACKAGE USING LEAD

摘要

PURPOSE: A method for fabricating a chip scale package using a lead is provided to fabricate easily a chip scale package by simplifying an existing fabrication process. CONSTITUTION: A patterned inner lead(15) is adhered on an active portion(12a) of a semiconductor chip(12) by using an adhesive tape(14). An outer lead(16) is adhered on the inner lead(15). The inner lead(15) is connected electrically with the semiconductor chip(12) by a bonding wire(17). A resin sealing portion(18) is formed by applying a resin on the whole surface of the active portion(12a) except for a back surface(12b) in order to protect the active portion(12a) of the semiconductor chip(12), the inner lead(15) formed on the active portion(12a), the outer lead(16) formed on the inner lead(15), and the bonding wire(17) from external environment. The semiconductor chip(12) is an edge pad type semiconductor chip with an electrode pad(13) formed around an edge the active portion(12a).