| 摘要 |
<p>A pick-up tool for the mounting of semiconductor chips onto a substrate has a suction device which consists of a plate (4) made out of a dimensionally stable material one surface of which (5) has structures (6) made of hardened adhesive. The material for the plate (4) is, for example, aluminium, a carbon fibre composite material or a dimensionally stable plastic. A suitable material for the structures (6) is, for example, an adhesive which has Teflon TM as the filling material. <IMAGE></p> |
