| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer carrier which can be used suitably for a batch type spin cleaner which prevents the formation of water marks on the surface of a wafer by effectively removing a liquid chemical from the surface, a method of cleaning wafer, and a method of manufacturing semiconductor device. SOLUTION: In a wafer carrier 1, a plurality of guide grooves 15 are formed in a state where the grooves 15 are oppositely arranged on the internal wall surface of a case body 11 having an opening 13, and wafers W are housed in the case body 11 in a laminated state by respectively putting the wafers W in the facing guide grooves 15. The partition walls 17 among the grooves 15 support the wafers W in inclined states, so that the opening 13 of the case body 11 may become higher than the bottom face of the case body 11 in a state where the case body 11 is arranged while one external wall surface 19a of the case body 11 in the arranging direction of the grooves 15 is maintained in a horizontal state. The case body 11 is fixed on the turntable 203 of the wafer cleaner under the condition such that the opening 13 is directed to a rotating shaft while the external wall surface 19a is maintained in a horizontal state.
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