| 摘要 |
PROBLEM TO BE SOLVED: To improve a structure of a wiring pattern which connects between two wire bonding grounds in a cavity of a ceramic circuit substrate, and realize a decrease in cost and mounting of a small size and a high density. SOLUTION: On an upper surface of a step part in a cavity 22 of a ceramic circuit substrate 21, a plurality of wire bonding grounds 24 are formed by a thick film method, and a terminal of an IC chip 23 mounted in the cavity 22 is connected to the wire bonding ground 24 by a bonding wire 25. A wiring pattern 26 connecting the two wire bonding grounds 24 is formed on a side surface of the cavity 22 by a suction printing method, and the two terminals of the IC chip 23 are connected by this wiring pattern 26. With this structure, it is unnecessary that the wiring pattern 26 connecting the two wire bonding grounds 24 is formed in three dimensions by a through conductor surrounding the cavity 22. |
