| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed wiring board where stable via connection having little irregularities in connection resistance value is realized by improving the filling property of conductive paste, when a via hole whose bottom is closed is filled with the conductive paste, and to provide the method of manufacturing the printed wiring board. SOLUTION: Conductive particle density in the conductive paste 306, with which the via hole 304 is filled, has gradient in such a manner that one hole bottom side is made high density in the thickness direction of an electrical insulating base substance 302. This manufacturing method includes a process, where the via hole is formed so that wiring material is exposed to a hole bottom, to the electrical insulating base substance in which wiring material 301 is formed at least on a single side, a process where the via hole is filled with the conductive paste, a process where the electric insulating base substance and the conductive paste are heated and pressed, and a process for forming wiring which is electrically connected with the conductive paste. In the paste- filling process, filling is performed, while resin component and conductive particles in the conductive paste are being separated from each other.
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