摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a printed wiring board for which disconnections or short-circuits will not occur. SOLUTION: The method of manufacturing a printed wiring board includes pasting transparent thermoplastic resin films 2 on photosensitive resin layers 11 formed on a substrate 1 and then exposing the photosensitive resin layers 11 to light. The thermoplastic resin films 2 are larger than the board 1, in both the longitudinal and transvers lengths. The thermoplastic resin films 2 are pasted so as to cover the entire surface of the board 1.
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