发明名称 METHOD OF MANUFACTURING PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a method of manufacturing a printed wiring board for which disconnections or short-circuits will not occur. SOLUTION: The method of manufacturing a printed wiring board includes pasting transparent thermoplastic resin films 2 on photosensitive resin layers 11 formed on a substrate 1 and then exposing the photosensitive resin layers 11 to light. The thermoplastic resin films 2 are larger than the board 1, in both the longitudinal and transvers lengths. The thermoplastic resin films 2 are pasted so as to cover the entire surface of the board 1.
申请公布号 JP2001345541(A) 申请公布日期 2001.12.14
申请号 JP20000163232 申请日期 2000.05.31
申请人 IBIDEN CO LTD 发明人 MATSUBARA SHIGEJI
分类号 G03F7/20;B23Q3/08;H05K3/00;H05K3/28;(IPC1-7):H05K3/28 主分类号 G03F7/20
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