发明名称 Method and apparatus for deposition of porous silica dielectrics
摘要 A method and apparatus for forming a dielectric layer. A dielectric precursor solution is deposited onto a surface of a substrate. The substrate is spun to spread the dielectric precursor solution over the surface of the substrate. A catalyst is introduced through a filter, wherein the filter causes a substantially homogenous distribution of the catalyst within the substrate, wherein a dielectric layer forms containing pores and wherein a solvent is contained in the pores. The solution is dried to form the dielectric layer using a carrier gas after introducing the catalyst, wherein the carrier gas places a positive pressure within the pores while removing the solvent to form a low-k dielectric layer.
申请公布号 US2001051403(A1) 申请公布日期 2001.12.13
申请号 US20010863979 申请日期 2001.05.23
申请人 MILLER GAYLE W.;SHELTON GAIL D. 发明人 MILLER GAYLE W.;SHELTON GAIL D.
分类号 H01L21/316;(IPC1-7):H01L21/823 主分类号 H01L21/316
代理机构 代理人
主权项
地址