发明名称 |
Method and apparatus for deposition of porous silica dielectrics |
摘要 |
A method and apparatus for forming a dielectric layer. A dielectric precursor solution is deposited onto a surface of a substrate. The substrate is spun to spread the dielectric precursor solution over the surface of the substrate. A catalyst is introduced through a filter, wherein the filter causes a substantially homogenous distribution of the catalyst within the substrate, wherein a dielectric layer forms containing pores and wherein a solvent is contained in the pores. The solution is dried to form the dielectric layer using a carrier gas after introducing the catalyst, wherein the carrier gas places a positive pressure within the pores while removing the solvent to form a low-k dielectric layer.
|
申请公布号 |
US2001051403(A1) |
申请公布日期 |
2001.12.13 |
申请号 |
US20010863979 |
申请日期 |
2001.05.23 |
申请人 |
MILLER GAYLE W.;SHELTON GAIL D. |
发明人 |
MILLER GAYLE W.;SHELTON GAIL D. |
分类号 |
H01L21/316;(IPC1-7):H01L21/823 |
主分类号 |
H01L21/316 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|