| 摘要 |
<p>An apparatus (10) for grinding and/or polishing a surface of a wall element includes a first elongate guide device (30) oriented substantially parallel to the surface of the wall element. A second elongate guide device (36) is movably coupled to the first elongate guide device and oriented orthogonally relative thereto. The second elongate guide device is oriented substantially parallel to the surface of the wall element and moves along the first elongate guide device. A polishing device (62) is movably coupled to the second elongate guide device. The polishing device moves along the second guide device and polishes the surface of the wall element at a plurality of locations along the second guide device and along the first guide device. The invention also relates to a method for grinding and/or polishing a surface of a wall element.</p> |
