Method for mounting a semiconductor chip on a substrate, and semiconductor device adapted for mounting on a substrate

摘要

A semiconductor device is adapted for mounting on a substrate (9) that has a chip-mounting region provided with a plurality of solder points (90). The semiconductor device includes a semiconductor chip having a pad-mounting surface provided with a plurality of bonding pads which are disposed on the pad-mounting surface at locations that are offset from locations of corresponding ones of the solder points (90) on the chip-mounting region. Conductive bodies (3) are formed on the pad-mounting surface to establish the required electrical connection among the bonding pads and the corresponding ones of the solder points (90).