Component retention clip for a heat sink assembly

摘要

The present invention is directed to a mounting clip for electronic components and, more specifically, to a component retention spring clip for securing electronic components to an electronic device support such as the leg of a heat sink. In one embodiment the component retention clip is comprised of a resilient strip that has an arcuate portion and first and second ends. The resilient strip is configured to encompass an electronic component and an electronic device support adjacent to the electronic component. The arcuate portion of the component retention clip contacts a portion of the electronic component, thereby partially supporting the electronic component against the electronic device support. Located at the first end of the resilient strip is a first latch configured to cooperatively engage a corresponding second latch located at the second end and retain the electronic component on the electronic device support.