| 摘要 |
PROBLEM TO BE SOLVED: To provide a BGA socket structure which can cope with a high-density mounting of BGA, and in which a high conduction reliability can be secured. SOLUTION: In the BGA socket structure wherein a solder ball 2a of BGA and a socket contact 22 are connected capable of conducting at a tip end part 22a of the socket contact 22, the tip end part 22a of the socket contact 22 is folded so that it shows a C-shape in a plane orthogonal in the direction of insertion and detachment of BGA to constitute so that it is capable of elastically expanding/contracting according to the insertion and detachment of the solder ball 2a.
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