发明名称 |
RADIATION SENSITIVE RESIN COMPOSITION |
摘要 |
PROBLEM TO BE SOLVED: To provide a radiation sensitive resin composition having a wide process margin and shelf stability and capable of forming an interlayer insulation film and microlenses excellent in heat and solvent resistances and transparency, and to provide an interlayer insulation film and microlenses obtained from the composition. SOLUTION: The radiation sensitive resin composition contains [A] a copolymer of (a1) an unsaturated carboxylic acid and/or its anhydride, (a2) a specified monomer containing an oxetanyl group and (a3) an olefinically unsaturated compound other than the components (a) and (a2) and [B] a 1,2-quinonediazido compound. |
申请公布号 |
JP2001330953(A) |
申请公布日期 |
2001.11.30 |
申请号 |
JP20000150080 |
申请日期 |
2000.05.22 |
申请人 |
JSR CORP |
发明人 |
MINOWA TAKAKI;ENDO MASAYUKI;NISHIMURA ISAO;NIWA KAZUAKI |
分类号 |
G03F7/033;C08F220/00;C08F220/04;C08F220/26;C08F222/02;C08F222/04;C08K5/28;C08L33/00;C08L35/00;C09D4/02;C09D5/00;C09D5/25;C09D133/04;C09D201/06;G02B1/04;G02B3/00;G03F7/022 |
主分类号 |
G03F7/033 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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