发明名称 FILM FORMING DEVICE FOR FILM COATED POWDER
摘要 PROBLEM TO BE SOLVED: To provide a film forming device for film coated powder which is capable of stably setting mechanical agitating conditions, ultrasonic dispersion conditions, a dropping rate for neutralization of an acid and alkali, heating conditions, or the like, under optimum conditions and forming coating films of a uniform thickness on substrate surfaces and is capable of desirably controlling the film thicknesses without the aggregation and solidification of the film coated powder with each other even when magnetic materials are used as the substrate without the deposition of only solid phase in a liquid phase in manufacture of the film coated powder by aqueous system reaction film formation. SOLUTION: The film forming device for forming the films on the surfaces of the substrate particles has a reaction chamber 1 having means for preventing the aggregation of contents and the means for preventing the aggregation is an ultrasonic wave oscillation machine.
申请公布号 JP2001321659(A) 申请公布日期 2001.11.20
申请号 JP20000143432 申请日期 2000.05.16
申请人 NITTETSU MINING CO LTD;NAKATSUKA KATSUTO 发明人 HOSHINO MARENOBU;SHINKO TAKASHI;OGURA SHINICHI;NAKATSUKA KATSUTO
分类号 B01J2/00;B01J13/02;(IPC1-7):B01J13/02 主分类号 B01J2/00
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