COMPOSITION FOR FILM FORMATION AND MATERIAL FOR INSULATION FILM FORMATION

摘要

PROBLEM TO BE SOLVED: To provide a composition for insulation film formation which is excellent in storage stability and can form a cured film excellent in heat resistance, electrical insulation properties (with a relative permittivity of 3 or lower), and crack resistance. SOLUTION: This composition contains (A) a polyamic acid and/or polyimide prepared by reacting a tetracarboxylic dianhydride with an amine compound containing a polyamine having at least three amino groups and (B) a hydrolyzate and/or condensate of at least one silane compound selected from the group consisting of (B-1) compounds represented by the formula: R1aSi(OR2)4-a and (B-2) compounds represented by the formula: R3b(R4O)3-bSi-(R7)d-Si-(OR5)3-cR6c.