发明名称 ORDINARY-TEMPERATURE CURABLE NON-WATER DISPERSIBLE RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a remarkably practical, ordinary-temperature curable and non-water-dispersible resin composition for a coating excellent in weather resistance, stain resistance and adhesion properties, little affecting on an old coating film and having excellent selectivity for a substrate. SOLUTION: The ordinary-temperature curable non-water-dispersible resin composition is obtained by incorporating, as curing agents, a compound bearing both an epoxy group and a hydrolyzable silyl group, a compound bearing an active isocyanate group, and further a silicone compound, an organic silicate compound and a specific hydrolysis/condensation catalyst into a non-aqueous dispersion containing a tertiary amino group and an active hydrogen atom reactive with an isocyanate group.
申请公布号 JP2001316446(A) 申请公布日期 2001.11.13
申请号 JP20000136924 申请日期 2000.05.10
申请人 DAINIPPON INK & CHEM INC 发明人 OTA KATSUMI;TOKUNAGA KOJI;KISHIGAMI SATORU;MUKAI TAKASHI
分类号 C08L51/00;C08F2/44;C08F291/12;C08G18/65;C09D133/14;C09D133/26;C09D157/06;C09D157/10;C09D175/02;C09D183/02;C09D183/04;(IPC1-7):C08G18/65 主分类号 C08L51/00
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