发明名称 |
Method of fabricating a MOS transistor having SEG silicon |
摘要 |
A method of fabricating a MOS transistor having SEG Si. After the formation of a gate and a spacer and before a source/drain region is formed, a selective epitaxial growth (SEG) Si is deposited over the substrate. The spacer is then removed to form an ultra shallow junction in the exposed substrate covered by the spacer after the formation of the SEG Si.
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申请公布号 |
US6316303(B1) |
申请公布日期 |
2001.11.13 |
申请号 |
US20000504563 |
申请日期 |
2000.02.15 |
申请人 |
UNITED MICROELECTRONICS CORP. |
发明人 |
LIN TONY;HUANG CHIEN-CHAO;HAO MING-YIN |
分类号 |
H01L21/28;H01L21/336;(IPC1-7):H01L21/823;H01L21/337 |
主分类号 |
H01L21/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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