| 摘要 |
<p>PROBLEM TO BE SOLVED: To feed a cutting water into a cutting zone of a cutter so as to certainly penetrate into fine portions of the cutting zone. SOLUTION: A cutting water is fed to a feed pipe 12 from a water supply 10 to feed it to a cutting blade of a cutting unit 32 of e.g. a wafer dicing apparatus 30, through this pipe provided with magnetically treating units 14, 16, 18 for fluids to exert a magnetic force on the cutting water flowing in the pipe 12, thus reducing the surface tension. This causes the cutting water fed to the cutting blade to penetrate into fine portions of a cutting zone and hence improve the cutting power and cleaning power, since it does not form drops on the work surface but diffuses. The magnetic force acts to prevent the cutting water flowing in the feed pipe 12 from dirtying.</p> |
