| 摘要 |
<p>PURPOSE: Provided is an adhesive tape for processing semiconductor wafers and/or semiconductor related materials, in particular for dicing said wafers or materials, wherein the tape enables the processing of very thin semiconductor wafers or materials without leading to any processing problems, simultaneously ensures good adherence of the wafer or material thereon and prevents delamination of the chips or parts therefrom during the dicing step. CONSTITUTION: The adhesive tape comprises at least one base film and an adhesive, wherein said at least one base film possesses perforations and has a cavity ratio of 3.0 to 90%. The base film comprises a synthetic resin or a non-woven fabric. The size of the perforations is from 0.001 to 3.2 mm2. The adhesive comprises a rubber- or acrylic-based adhesive. The adhesive is pressure-sensitive, light-sensitive and/or heat-sensitive and has an elongation of more than 10%. Also, the adhesive has a tensile strength of more than 0.1 N/20 mm, and an adhesive strength of 0.15 to 10 N/20 mm.</p> |
