RESISTOR MODULAR SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a resistor modular substrate having a low cost, high performance resistor chip structure in which DC resistor chips can be connected within the pattern pitch of a bus wiring on a wiring circuit board while reducing parasitic capacity and inductance. SOLUTION: The resistor modular substrate 10 comprises a plurality of independent DC resistor chips 11 formed of a thin film resistor 13 wherein the DC resistor chips 11 are formed within the pattern pitch of a bus wiring 20 on a wiring circuit board for mounting the DC resistor chips 11 and flip-chip electrode terminals 14 are provided at the opposite ends of the DC resistor chips 11.