发明名称 METHOD FOR MANUFACTURING LAMINATED CERAMIC ELECTRIC PARTS
摘要 PROBLEM TO BE SOLVED: To solve a problem that a conductive paste enters a clearance between a ceramic green sheet and a porous sheet when a via hole is filled with the conductive paste to form a via hole conductor, in a state where a negative pressure is applied into the via hole by means of the porous sheet in contact with the ceramic green sheet, and the conductive paste is dried thereafter. SOLUTION: While a porous sheet 16 is kept in contact with a flat suction surface 25 of a suction plate 24, a negative pressure is applied to the porous sheet 16 by means of the suction plate 24. Thus, a conductive paste 17 for a via hole conductor 4 is heated and dried in a state where a ceramic green sheet 8 and the porous sheet 16 are sucked to the suction surface 25.
申请公布号 JP2001307943(A) 申请公布日期 2001.11.02
申请号 JP20000116629 申请日期 2000.04.18
申请人 MURATA MFG CO LTD 发明人 SAKAI NORIO;BABA AKIRA
分类号 B28B11/00;H01G4/12;H01G4/30;H01L23/12;H05K3/40;H05K3/46;(IPC1-7):H01G4/12 主分类号 B28B11/00
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