ELECTROLYTIC PLATING METHOD AND DEVICE FOR PRINTED BOARD

摘要

PURPOSE: An electrolytic plating method and a device for a printed board are provided to fill a via hole of a wiring board in a short time. CONSTITUTION: In an electrolytic plating method for a printed board, an insoluble anode(22) is arranged opposite to the printed board forming a cathode(23) in a plating bath(21). The printed board has a printed pattern and a via hole formed by laser. As the insoluble anode(22), porous electrode such as expand metal is used. A power supply(24) makes positive pulse current and a negative pulse current flow between the anode(22) and the cathode(23). By adding Fe ion Fe2+ more than 0.1g/L to copper plating solution and pulse reverse electrolytic plating, a via hole of the wiring board is filled in a short time. The plating solution is shaken to flow in parallel with the surface of the wiring board. A copper solution bath(25) supplies Cu ion to the plating bath(21).