| 摘要 |
A polishing apparatus for polishing a plate-like workpiece by way of a relative sliding motion between the plate-like workpiece and a polishing surface. The polishing apparatus comprises a carrier for holding the plate-like workpiece. The carrier comprises a carrier body having a flat surface and one or more recesses formed in the carrier body surface, an inner sheet covering the carrier body surface and having an outer peripheral edge sealingly connected to the carrier body, an outer sheet covering the inner sheet and having an outer peripheral edge sealingly connected to the carrier body, and a pressure supply device for providing selectively a negative pressure or a positive pressure between the inner sheet and the carrier body surface so that, upon provision of the negative pressure, a suction force is created on the outer surface of the outer sheet to draw a workpiece against the outer sheet and, when applied the positive pressureacts on the workpiece through the inner and outer sheets to press the workpiece against the polishing surface. |
