发明名称 LSI package structure
摘要 An LSI package structure having a smaller size in which the wiring length is shortened. The wiring structure for connecting the LSI 2 with the wiring board 1 comprises first connecting terminals 3 arrayed on the LSI 2 and second connecting terminals 6 arrayed on the wiring board 1. The first connecting terminals 3 are arrayed on the outer periphery 5 of the facing surface 4 which faces the wiring board 1 and the second connecting terminals 6 are arrayed on the interfacing surface 7 which intersects with the outer periphery 5. In such a structure, the wiring board 1 is similar to the LSI 2 in size. The facing surface 4 actually intersects with the intersecting face 7 for forming a intersecting line 8. The facing surface 4 substantially intersects with the intersecting face 7 along the intersecting line 8. Such a structure makes the size of the wiring board 1 smaller than that of the LSI 2.
申请公布号 US6303876(B1) 申请公布日期 2001.10.16
申请号 US20000570570 申请日期 2000.05.12
申请人 NEC CORPORATION 发明人 MIYAZAKI HIROKAZU
分类号 H01L23/12;H01L23/498;(IPC1-7):H05K1/16;H05K7/02 主分类号 H01L23/12
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