发明名称 METHOD AND APPARATUS FOR FORMING SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a method for forming a substrate wherein particles become uniform, a quench crack and the like are not generated, purity and dimensional accuracy are high, and variously shaped substrates can be formed in a short time. SOLUTION: A suspension 3 containing a substrate structure is allowed to flow between a first mold body 1 and a second mold body 2 contained in the first mold body 1. The first mold body 1, and the second mold body 2 are made electrodes, electricity is applied to suspension 3, and the substrate structure is coagulated to form the substrate 4.
申请公布号 JP2001287212(A) 申请公布日期 2001.10.16
申请号 JP20000103061 申请日期 2000.04.05
申请人 TSURUGA YASUTAKA 发明人 TSURUGA YASUTAKA
分类号 B28B1/26;(IPC1-7):B28B1/26 主分类号 B28B1/26
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