| 摘要 |
PROBLEM TO BE SOLVED: To provide electronic components which can be constituted in a small size with a simple constitution, reduced in component cost and assembling cost, and improved in mounting reliability. SOLUTION: In the electronic components 10, containing a resin-made base 11 and circuit elements 12 and 13 arranged on the base 11, the base 11 is provided with a plurality of integrally molded projecting sections 15. The parts 10 are constituted, in such a way that when the parts 10 are mounted on a mounting substrate 16, the terminals of the connecting lead wires 13a of the circuit elements 12 and 13 are respectively wound around their corresponding projecting sections 15, so as to be soldered to the connection lands of the substrate 16.
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