发明名称 ELECTRONIC COMPONENT ELEMENT MOUNTING EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To provide electronic component element mounting equipment which can fix a base with stability and mount an electronic component element surely with stability as well. SOLUTION: The electronic component element mounting equipment consists of a means for holding an electronic component element 1 having a bump electrode 1a on the lower plane, a fusion generating means for heat fusion or supersonic waves fusion of the bump electrode 1a to the base 2, a tool 7 having a pressing means, and a work fixing part 4 fixing the basic 2 mounted with the electronic component element. An elastic sheet 3 composed of a silicone resin is arranged on the base fixing plane of the work fixing part 4.
申请公布号 JP2001284409(A) 申请公布日期 2001.10.12
申请号 JP20000098396 申请日期 2000.03.31
申请人 KYOCERA CORP 发明人 OIKAWA AKIRA;HISATAKA MASAFUMI
分类号 H01L21/60 主分类号 H01L21/60
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