发明名称 SUBSTRATE-FREE, THERMALLY CONDUCTIVE PRESSURE-SENSITIVE ADHESIVE TAPE OR SHEET AND METHOD FOR MANUFACTURING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a substrate-free thermally conductive pressure-sensitive adhesive tape or sheet that is good in basic adhesive properties such as adhesive force, retention force at high temperatures, or the like, and is excellent in thermal conductivity. SOLUTION: This substrate-free, thermally conductive pressure-sensitive adhesive tape or sheet is produced by using a photocurable, thermally conductive pressure-sensitive adhesive comprising as main components an alkyl (meth) acrylate monomer, a polar group-containing monomer, an acrylic polymer having a photoactive functional group, a photopolymerization initiator and thermally conductive particles and polymerizing the adhesive by light irradiation, wherein the acrylic polymer having a photoactive functional group has a weight average molecular weight of 200,000-3,000,000 and the content of the photoactive functional group is 0.001-0.5 milliequivalent/g and wherein the content of the thermally good conductive material is 10-300 pts.wt. per 100 pts.wt. photocurable pressure-sensitive adhesive in the photocurable, thermally conductive pressure- sensitive adhesive.
申请公布号 JP2001279196(A) 申请公布日期 2001.10.10
申请号 JP20000093311 申请日期 2000.03.30
申请人 SLIONTEC CORP 发明人 HARADA MINAKO;SATO AKIKO;NATE KAZUO
分类号 C09J7/00;C09J11/04;C09J133/00;(IPC1-7):C09J7/00 主分类号 C09J7/00
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