发明名称 REFLOW FURNACE
摘要 PROBLEM TO BE SOLVED: To provide a reflow furnace which can easily realize several temperature profiles and need a small front and back space only for installation. SOLUTION: This device is provided with a pre-heating chamber 2 which vertically extends, a heating chamber 3 which extends back and forth and of which back terminal is junctioned with the upper part of the pre-heating chamber 2 and a cooling chamber 4 which vertically extends and of which upper part is junctioned with the front terminal of the heating chamber 3. A lifting device 5 which intermittently transfers substance S to be processed upwards is provide in the pre-heating chamber 2, a forward transfer device 6 which intermittently transfers the substance S to be processed forwards is provided in the heating chamber 3 and a lower transfer device 7 which intermittently transfers the substance S to be processed downwards is provide in the cooling chamber 4.
申请公布号 JP2001274541(A) 申请公布日期 2001.10.05
申请号 JP20000083330 申请日期 2000.03.24
申请人 KOYO THERMO SYSTEM KK 发明人 MORIMOTO IWAO;MATSUMOTO DAISUKE
分类号 B23K1/00;B23K1/008;H05K3/34;(IPC1-7):H05K3/34 主分类号 B23K1/00
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