| 摘要 |
PROBLEM TO BE SOLVED: To provide a technology capable of forming a multilayer wiring having W plugs with high reliability at a low cost. SOLUTION: An outside W film, having a hole pattern 5, is removed 80 to 90% by an etch back method, and then the remaining outside W film (remaining W film 7a) having a hole pattern 5 and an adhesive layer 6 are removed by a chemical-mechanical polishing method.
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