发明名称 Liquid cooled plate mould
摘要 Liquid-cooled plate mold comprises high heat conducting mold plates (1) made from copper or copper alloy connected to a water chamber and/or support plate (4) using fixing elements (2). Molded parts (6) having a thread (5) are arranged on the water side of each mold plate and are connected to the mold plates as fixing pieces by solder connections (7, 7') or by welding connections. Preferred Features: The molded parts and/or the fixing pieces are made from a conducting material, such as CuAg, CuCrZr, CuNiBe or CuNiFe. The fixing pieces are connected to the mold plates by a soft solder layer.
申请公布号 EP1138417(A1) 申请公布日期 2001.10.04
申请号 EP20010107099 申请日期 2001.03.22
申请人 SMS DEMAG AG 发明人 STREUBEL, HANS;GIRGENSOHN, ALBRECHT, DR.;PORAN, MICHAEL
分类号 B22D11/04;B22D11/055;B22D11/057;B22D11/059;B23K35/26;B23K35/28;B23K35/30 主分类号 B22D11/04
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