| 摘要 |
<p>PURPOSE: To provide a solid-state imaging device which is improved regarding the formability, productivity, airtightness and heat radiation and can be made thin, thus improving the quality of the image sensor and reducing the cost. CONSTITUTION: The solid-state imaging device 51 has a package 59 integrated with a lead frame 57 sandwiched between thermosetting resin-made upper and lower packages, and outline references provided on the side face of the package 59. All the side faces of the upper and lower packages are tapered 61, the integrated package 59 has a plurality of holes 69a, 69b, 71a, 71b vertically piercing it, notches 67 are formed into both side faces of the package 59, thereby exposing parallel two sides of the lead frame 57, and the holes 69a, 69b, 71a 71b are provided on the respective lead frame parts 57 exposed through the notches 67.</p> |
